Cylindrical compact, manufacturing method of cylindrical sputtering target, and manufacturing method of cylindrical sintered compact

ABSTRACT

A cylindrical sputtering target includes a plurality of cylindrical sintered compacts adjacent to each other while having a space therebetween. The plurality of cylindrical sintered compacts have a relative density of 99.7% or higher and 99.9% or lower. The plurality of cylindrical sintered compacts adjacent to each other have a difference therebetween in the relative density of 0.1% or smaller.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is based upon and claims the benefit of priority fromthe prior Japanese Patent Application No. 2015-067552 filed on Mar. 27,2015, the entire contents of which are incorporated herein by reference.

FIELD

The present invention relates to a cylindrical sputtering target, acylindrical sintered compact, a cylindrical compact and a manufacturingmethod of the same.

BACKGROUND

Recently, manufacturing technologies of flat panel displays (FPDs) andsolar cells have been rapidly developed, and markets of large-screenthin TVs and solar cells have been expanded. Along with the expansion ofthe markets of these products, glass substrates have been progressivelyenlarged for the purpose of decreasing the manufacturing cost of theproducts. Today, manufacturing devices for the eighth generation glasssubstrates having a size of 2200 mm×2400 mm are being developed.Especially, in the field of sputtering devices for forming a metal thinfilm or a metal oxide thin film on a large glass substrate, aconventional flat sputtering target is now replaced with a cylindrical(also referred to as “rotary” or “rotatable”) sputtering target. Acylindrical sputtering target has advantages over a flat sputteringtarget that the use efficiency of the target is high, the erosion occursless, and generation of particles by delamination of depositedsubstances occurs less.

A cylindrical sputtering target usable for a sputtering device forforming a thin film on a large glass substrate as described above needsto have a length of at least 3000 mm. It costs high and thus is notpractical to manufacture, by integral molding, and grind such a longcylindrical sputtering target. Therefore, usually, a plurality ofcylindrical sintered compacts each having a length of several tenmillimeters or greater and several hundred millimeters or less arecoupled together to form a cylindrical sputtering target.

Generally, a sintered compact, encompassing the above-describedcylindrical sintered compact, needs to have a high density in order tohave an improved mechanical strength and also in order to allow a thinfilm formed of the sintered compact to have an improved film quality. Inorder to realize a sintered compact having a high density, JapaneseLaid-Open Patent Publication No. 2014-040348, for example, discloses atechnology for increasing the density of a compact to be sintered to amaximum possible level. In a sputtering target including a plurality ofsintered compacts coupled together as described above, the difference inthe density between adjacent sintered compacts (namely, the“inter-individual sintered compact variance” in the density) influencesthe sputtering characteristics.

As compared with a flat sintered compact, a cylindrical sintered compactis complicated in the contraction behavior when being sintered. Whenbeing contracted greatly, the cylindrical sintered compact is easilydistorted. Like with the flat sintered compact, in the case where ahighly dense cylindrical compact is formed in order to decrease thecontraction amount during the sintering, a binder or the like includedin the compact is not easily pulled off, which prevents the compact fromhaving a desired shape as a result of the contraction.

SUMMARY

A cylindrical sputtering target in an embodiment according to thepresent invention includes a cylindrical sintered compact having arelative density of 99.7% or higher and 99.9% or lower.

A cylindrical sintered compact usable to manufacture a cylindricalsputtering target in an embodiment according to the present inventionhas a relative density of 99.7% or higher and 99.9% or lower.

In another embodiment, the cylindrical sputtering target includes aplurality of cylindrical sintered compacts adjacent to each other whilehaving a space therebetween, and the plurality of cylindrical sinteredcompacts adjacent to each other may have a difference therebetween inthe relative density of 0.1% or smaller.

A cylindrical compact usable to form a cylindrical sintered compactusable to manufacture a cylindrical sputtering target in an embodimentaccording to the present invention has a relative density of 54.5% orhigher and 58.0% or lower.

In another embodiment, the cylindrical compact may be formed by coldisostatic pressing performed at a pressure of 100 MPa or higher and 200MPa or lower.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a perspective view showing an example of cylindrical sinteredcompacts included in a cylindrical sputtering target in an embodimentaccording to the present invention;

FIG. 2 is a cross-sectional view showing an example of cylindricalsputtering target in an assembled state in an embodiment according tothe present invention;

FIG. 3 shows a process flow of a manufacturing method of the cylindricalsintered compact and a cylindrical sputtering target in an embodimentaccording to the present invention; and

FIG. 4 shows the relationship between the density of the cylindricalcompact and the density of the cylindrical sintered compact in themanufacturing method of the cylindrical sintered compact in theembodiment according to the present invention.

DESCRIPTION OF EMBODIMENTS

Hereinafter, a cylindrical sputtering target and a manufacturing methodthereof according to an embodiment of the present invention will bedescribed with reference to the drawings. The cylindrical sputteringtarget and the manufacturing method thereof according to an embodimentof the present invention may be carried out in various differentembodiments, and are not to be construed as being limited to any of thefollowing embodiments. In the drawings referred to in the embodiments,components that are the same or have substantially the same functionsbear the identical reference signs, and detailed descriptions thereofmay be omitted. The following embodiments are presented for the purposeof providing a cylindrical sputtering target, a cylindrical sinteredcompact and a cylindrical compact having little distortion and a highstrength, and a manufacturing method of the same. An embodiment of thepresent invention has an object of providing a cylindrical sputteringtarget, a cylindrical sintered compact and a cylindrical compact havinga highly uniform quality, and a manufacturing method of the same.

In the following description, the density of a compact and the densityof a sintered compact are each expressed with the relative density. The“relative density” is represented by use of the theoretical density andthe measured density; namely, the relative density=(measureddensity/theoretical density)×100(%). The “theoretical density” is avalue of the density that is calculated based on the materials used. Inthe case where the materials are provided such that indium oxide has acontent of 90% by mass and tin oxide has a content of 10% by mass, thetheoretical density is calculated as (density of In₂O₃(g/cm³)×90+density of SnO₂ (g/cm³)×10)/100. The density of In₂O₃ iscalculated as 7.18 g/cm³, and the density of SnO₂ is calculated as 6.95g/cm³. Thus, the theoretical density is calculated as 7.15 (g/cm³). The“measured density” is a value obtained by dividing the weight by thevolume. In the case of a compact, the measured density is calculated byuse of the volume obtained by actually measuring the sizes. In the caseof a sintered compact, the measured density is calculated by use of thevolume obtained by the Archimedean Method.

The inter-sintered compact difference is the difference in the relativedensity. For example, the difference in the relative density betweensintered compact A having a relative density of 99.5% and sinteredcompact B having a relative density of 99.6% is calculated as99.6%−99.5%=0.1%. In the case where the sintered compacts have the samecomposition, the theoretical density of the sintered compacts is thesame. Therefore, the variance between adjacent sintered compacts isevaluated by simply finding the difference between the adjacent sinteredcompacts. The maximum value among the differences between the adjacentsintered compacts is evaluated as the difference. The sputtering targetaccording to an embodiment of the present invention is applicable to anassembly including a plurality of sintered compacts of the samecomposition that are coupled together.

Embodiment

With reference to FIG. 1 through FIG. 4, a structure of a cylindricalsputtering target and a structure of a cylindrical sintered compact inan embodiment according to the present invention will be described.First, with reference to FIG. 1 and FIG. 2, an overview of thecylindrical sputtering target will be described.

[Overview of the Cylindrical Sputtering Target]

FIG. 1 is a perspective view of an example of a plurality of cylindricalsintered compacts 110 included in a cylindrical sputtering target 100 inan embodiment according to the present invention. As shown in FIG. 1,the sputtering target 100 includes the plurality of cylindrical sinteredcompacts 110, which are hollow. The plurality of cylindrical sinteredcompacts 110 are located adjacent to each other while having a certainspace therebetween. In FIG. 1, the space between each two adjacentcylindrical sintered compacts 110 is shown larger than the actual sizefor the sake of convenience.

The cylindrical sintered compacts 110 each preferably have a relativedensity of 99.7% or higher and 99.9% or lower. The difference in therelative density between adjacent cylindrical sintered compacts 110 aand 110 b or between adjacent cylindrical sintered compacts 110 b and110 c, namely, the inter-individual cylindrical sintered compactdifference in the relative density is preferably 0.1% or smaller.

The cylindrical sintered compacts 110 may each have a thickness of 6.0mm or greater and 15.0 mm or less. The cylindrical sintered compacts 110may each have a length in an axial direction of 150 mm or greater and380 mm or less. Adjacent cylindrical sintered compacts 110 may have aspace having a length in the axial direction of 0.2 mm or greater and0.5 mm or less. The sputtering target 100 preferably has an averagesurface roughness (Ra) of 0.5 μm or less.

The cylindrical sintered compacts 110 are preferably formed of a ceramicmaterial such as ITO (indium tin oxide), IGZO(indium-gallium-zinc-oxide) or the like.

FIG. 2 is a cross-sectional view showing an example of cylindricalsputtering target 100 in an embodiment according to the presentinvention in an assembled state. As shown in FIG. 2, the cylindricalsputtering target 100 in an assembled state includes a cylindricalsubstrate 130 in a hollow inside of the cylindrical sintered compacts110 shown in FIG. 1. The cylindrical substrate 130 and the cylindricalsintered compacts 110 are joined together by blazing with a blazingmember 140, and each two adjacent cylindrical sintered compacts 110 arelocated while having a space 120 therebetween.

The cylindrical substrate 130 may be formed of a metal material that hasa sufficiently high thermal conductivity to efficiently release heatgenerated by collision of electrons and ions against the target at thetime of sputtering of the target and also has a sufficiently highelectrical conductivity to allow a bias voltage to be applied to thetarget. Specifically, the cylindrical substrate 130 may be formed of Ti,Cu, an alloy containing Ti or Cu, or stainless steel (SUS).

The blazing member 140 may be formed of a material having a high thermalconductivity and a high electrical conductivity like the cylindricalsubstrate 130 and also having a sufficiently high adhesiveness andstrength to allow the cylindrical substrate 130 to retain thecylindrical sintered compacts 110. The thermal conductivity of theblazing member 140 may be lower than that of the cylindrical substrate130. The electrical conductivity of the blazing member 140 may be lowerthan that of the cylindrical substrate 130. The blazing member 140 maybe formed of, for example, indium (In), tin (Sn) or an alloy containingIn or Sn.

As described above, in the sputtering target in this embodiment, therelative density of the cylindrical sintered compacts is in theabove-described range, so that effects are provided that the mechanicalstrength of the cylindrical sintered compacts is improved and that athin film formed of the cylindrical sintered compact contains lessimpurities and has an improved film density. In addition, theinter-individual cylindrical sintered compact difference in the relativedensity is in the above-described range, so that the distortion in theelectric field is suppressed in the cylindrical sputtering targetincluding the plurality of cylindrical sintered compacts. As a result,stable discharge characteristics are obtained at the time of sputtering,and a thin film having a highly uniform in-plane quality may be formedon a large substrate having a size exceeding the size of one cylindricalsintered compact.

[Manufacturing Method of the Cylindrical Sintered Compact]

Now, with reference to FIG. 3, a manufacturing method of a cylindricalsintered compact included in the cylindrical sputtering target accordingto an embodiment of the present invention will be described in detail.FIG. 3 shows a process flow of a manufacturing method of a cylindricalsintered compact and a cylindrical sputtering target in an embodimentaccording to the present invention. The sintered compact manufactured bythe method shown in FIG. 3 contains ITO (indium tin oxide) as anexample. The sintered compact is not limited to containing ITO, and themanufacturing method shown in FIG. 3 is applicable to a sintered compactcontaining IGZO or any other appropriate metal oxide material.

First, materials are prepared. The materials to be mixed are metalelements contained in, for example, an oxide or an alloy. The materialsmay be powdery, and appropriate materials may be selected in accordancewith the composition of the sputtering target to be manufactured. In thecase where, for example, ITO is used for the sintered compact, powder ofindium oxide and powder of tin oxide are prepared (steps S301 and S302).These materials each have a purity of generally 2 N (99% by mass) orhigher, preferably 3 N (99.9% by mass) or higher, or more preferably 4 N(99.99% by mass) or higher. In the case where the purity is less than 2N, the cylindrical sintered compact contains a large amount ofimpurities, which causes a problem that desired physical properties arenot obtained (for example, the permeability is decreased; the resistanceof the film is increased; or in the case where the foreign substancesare contained locally, arcing occurs and thus particles are generated).

Next, these powdery materials are pulverized and mixed (step S303). Thepowdery materials are pulverized and mixed by a dry method using ballsor beads of zirconia, alumina, nylon resin or the like, a mediumstirring mill method using such balls or beads, a medium-less containerrotation method, a mechanical stirring method, a wet method using a gasstream. Generally, a wet method is superior to a dry method inpulverizing and mixing capabilities. Therefore, it is preferable to usethe wet method for the mixing.

There is no specific limitation on the composition of the materials, andit is preferable to appropriately adjust the composition in accordancewith the composition ratio of the sputtering target to be manufactured.

Use of powdery materials having a small powder diameter allows thesintered compact to have a high density. The powdery materials havingsuch a small powder diameter may be obtained by using stricterconditions for the pulverization. However, in this case, the materialsare contaminated with a larger amount of medium used for thepulverization (zirconia, etc.), which increases the concentration ofimpurities in the product. Therefore, the conditions for thepulverization need to be set to appropriate ranges in consideration ofthe balance between the density of the sintered compact and theconcentration of the impurities in the product.

Next, a slurry of the powdery materials is dried and granulated (stepS304). In this step, rapid dry granulation of rapidly drying the slurrymay be performed. The rapid dry granulation may be performed byadjusting the temperature and the amount of the hot air by use of aspray dryer. The rapid dry granulation suppresses the powder of indiumoxide and the powder of tin oxide from being separated from each otherdue to the difference in the precipitation rate, which is caused by thedifference in the specific gravity between the powdery materials. Such amanner of granulation uniformizes the ratio of the components and thusimproves the ease of handling of the powdery materials. Preliminarysintering may be performed before the granulation.

Next, the mixture obtained by the mixing step and the granulation stepdescribed above (in the case where the preliminary sintering step isperformed, the preliminarily sintered mixture) is molded bypressurization to form a cylindrical compact (S305). In this step, themixture or the preliminarily sintered mixture is formed into a shapepreferable to the sputtering target to be manufactured. The molding maybe performed by metallic molding, cast molding, injection molding or thelike. In order to obtain a complicated shape such as a cylindrical shapeor the like, the molding is preferably performed by cold isostaticpressing (CIP) or the like. The molding by CIP is performed as follows.A rubber mold is filled with the powdery materials each having apredetermined weight. At this point, the rubber mold is filled whilebeing swung or tapped, so that the rubber mold is prevented from beingfilled with the powdery materials non-uniformly or from having a spacetherein. The molding by CIP is preferably performed at a pressure of 100MPa or higher and 200 MPa or lower. In this embodiment, the pressure atthe time of molding is adjusted as described above, so that acylindrical compact having a relative density of 54.5% or higher and58.0% or lower is formed. More preferably, the molding by CIP isperformed at a pressure of 150 MPa or higher and 180 MPa or lower. Inthis case, a cylindrical compact having a relative density of 55.0% orhigher and 57.5% or lower is formed.

Next, the cylindrical compact obtained by the molding step is sintered(step S306). The sintering is performed by use of an electric furnace.Sintering conditions may be appropriately selected in accordance withthe composition of the sintered compact to be formed. For example, asintered compact containing ITO that contains SnO₂ at a content of 10%by mass may be obtained by sintering performed at a temperature of 1500°C. or higher and 1600° C. or lower for a time duration of 10 hours orlonger and 20 hours or shorter in an oxygen gas atmosphere. In the casewhere the sintering temperature is lower than 1500° C., the density ofthe sputtering target to be manufactured is too low. By contrast, in thecase where the sintering temperature is higher than 1600° C., theelectric furnace and the refractory material are excessively damaged andthus need to be subjected to maintenance whenever necessary, whichsignificantly decreases the work efficiency. In the case where thesintering time duration is shorter than 10 hours, the density of thesputtering target to be manufactured is too low. In the case where thesintering time duration is longer than 20 hours, the compact is kept inthe sintering step for too long, which deteriorates the operating ratioof the electric furnace. In addition, the amount of oxygen gas consumedin the sintering step and the electric power necessary to operate theelectric furnace are increased. The sintering step may be performed atatmospheric pressure or in a reduced or increased pressure atmosphere.

In the case where an electric furnace is used for sintering, theincreasing rate and the decreasing rate of the sintering temperature maybe adjusted to suppress the generation of cracks. Specifically, theincreasing rate of the temperature of the electric furnace during thesintering is preferably 300° C./hour or lower and more preferably 180°C./hour or lower. The decreasing rate of the temperature of the electricfurnace during the sintering is preferably 600° C./hour or lower. Theincreasing rate and the decreasing rate of the temperature may beadjusted so as to be changed step by step.

The cylindrical compact is contracted by the sintering step. Before thetemperature in the furnace reaches a level at which the thermalcontraction of the cylindrical compact starts (at a temperature lowerthan the temperature at which the thermal contraction starts), thetemperature in the furnace is retained at a certain level. Thisuniformizes the temperature in the furnace, and all of the sinteredcompacts located in the furnace are contacted uniformly. The sinteringtemperature and the sintering time duration may be set appropriately foreach of materials of the cylindrical compact to be sintered, so thatsintered compacts having a stable density are obtained.

Next, the obtained cylindrical sintered compacts are mechanicallyprocessed into a desired cylindrical shape by use of a mechanicalprocessor such as a flat grinder, a cylindrical grinder, a lathe, acutting machine, a machining center or the like (step S307). Themechanical processing is performed in order to allow the above-describedcylindrical sintered compact to have a shape suitable to be attached toa sputtering device. The mechanical processing is performed also inorder to cause the cylindrical sintered compact to have a desiredsurface roughness. The cylindrical sintered compact preferably has anaverage surface roughness (Ra) of 0.5 μm or less so as to besufficiently flat to prevent abnormal discharge from being caused due toconcentration of the electric field during sputtering. The cylindricalsintered compact obtained as a result of the above-described steps has ahigh density and a high quality uniformity.

Next, the mechanically processed cylindrical sintered compact is bondedto a substrate (step S308). Specifically in the case where a cylindricalsputtering target is to be manufactured, the cylindrical sinteredcompact is bonded to a cylindrical substrate called a “backing tube”with a blazing material used as an adhesive. As a result of theabove-described steps being performed, a cylindrical sputtering targetincluding a plurality of the above-described cylindrical sinteredcompacts is obtained.

As described above, according to the manufacturing method of thecylindrical sputtering target in this embodiment, the pressure at thetime of molding may be 100 MPa or higher and 200 MPa or lower, so thatcylindrical compacts having a relative density of 54.5% or higher and58.0% or lower are obtained. The cylindrical compacts are sintered tostably obtain cylindrical sintered compacts having a very high densityof 99.7% or higher and 99.9% or lower. In addition, the cylindricalsintered compacts are manufactured at a high reproducibility, andtherefore the difference in the relative density between the pluralityof cylindrical sintered compacts adjacent to each other is 0.1% orsmaller.

FIG. 4 shows the relationship between the density of the cylindricalcompact and the density of the cylindrical sintered compact in themanufacturing method of the cylindrical sintered compact in theembodiment according to the present invention. In FIG. 4, the horizontalaxis represents the density of the cylindrical compact, whereas thevertical axis represents the density of the cylindrical sintered compactobtained by sintering the cylindrical compact. The cylindrical compactin FIG. 4 is formed by molding performed at a pressure of 100 MPa orhigher and 200 MPa or lower. The cylindrical sintered compact in FIG. 4is obtained as a result of the cylindrical compact being sintered at asintering temperature of 1560° C. for 20 hours. The densities isevaluated by the Archimedean Method.

As a result of active studies, the present inventors have found that inthe case where the density of the cylindrical sintered compact isrepresented by the function of the density of the cylindrical compact asshown in FIG. 4, the density of the cylindrical sintered compact has amaximum. This will be described more specifically. Conventionally, it isconsidered that in order to obtain a cylindrical sintered compact havinga high density, it is necessary to form a cylindrical compact having ashigh a density as possible. The studies made by the present inventorshave found that there is a range of density of the cylindrical compactthat is suitable to obtain a cylindrical sintered compact having ahigher density. Especially in order to decrease the ratio of defectiveproducts caused by arcing or the like during use by a user, it isdesirable that the cylindrical sintered compact has a relative densityof 99.7% or higher. A cylindrical sintered compact having a relativedensity of 99.7% or higher is obtained in the case where the cylindricalcompact has a relative density of 54.5% or higher and 58.0% or lower.

An embodiment of the present invention provides a cylindrical sputteringtarget, a cylindrical sintered compact and a cylindrical compact havinglittle distortion and a high strength, and a manufacturing method of thesame. An embodiment of the present invention also provides a cylindricalsputtering target, a cylindrical sintered compact and a cylindricalcompact having a highly uniform quality, and a manufacturing method ofthe same.

EXAMPLES Example 1 [Manufacturing of the Cylindrical Sputtering Target]

In example 1, a manufacturing method of a cylindrical ITO target(cylindrical sintered compact) will be described. First, 4 N indiumoxide having a BET (Brunauer, Emmet and Teller's equation) specificsurface area of 4.0 to 6.0 m²/g and 4 N tin oxide having a BET specificsurface area of 4.0 to 5.7 m²/g were prepared as powdery materials. The“BET specific surface area” is a surface area obtained by the BETmethod. According to the “BET method”, gas molecules of nitrogen, argon,krypton, carbon oxide or the like are adsorbed to solid particles, andthe specific surface area of the solid particles is measured based onthe amount of the adsorbed gas molecules. In this example, the materialswere prepared such that indium oxide had a content of 90% by mass andtin oxide had at a content of 10% by mass. Next, these powdery materialswere pulverized and mixed together by a wet ball mill. As thepulverization medium, zirconia balls were used. A slurry obtained as aresult of the mixing was subjected to rapid dry granulation performed byuse of a spray dryer.

Next, the mixture obtained by the granulation step was molded by CIP tohave a cylindrical shape. The pressure at the time of molding by CIP was150 MPa.

A cylindrical compact obtained by the molding step had the followingparameters.

Outer diameter of the cylinder: 190 mm

Inner diameter of the cylinder: 159 mm

Length in the axial direction of the cylinder: 280 mm

Density of the compact: 4.00 g/cm³

Relative density of the compact: 55.9%

The relative density of the cylindrical compact was calculated based onthe size and the weight thereof.

Next, the cylindrical compact obtained by the CIP was sintered by use ofan electric furnace. The sintering conditions were as follows.

Increasing rate of the temperature: 300° C./hour

Sintering temperature: 1560° C.

Sintering time duration: 20 hours

Atmosphere at the time of sintering: Oxygen atmosphere

Pressure at the time of sintering: Atmospheric pressure

The cylindrical sintered compact obtained by the above-describedsintering step had the following parameters.

Outer diameter of the cylinder: 157 mm

Inner diameter of the cylinder: 131 mm

Length in the axial direction of the cylinder: 230 mm

Density of the sintered compact: 7.131 g/cm³

Relative density of the sintered compact: 99.7%

Namely, the contraction ratio of the cylindrical compact by thesintering step was 80%. In example 1, the difference in the relativedensity among a plurality of the cylindrical sintered compacts was0.03%. The relative density of the cylindrical sintered compacts wasmeasured by use of the Archimedean Method.

Next, the cylindrical sintered compact obtained by the sintering stepwas mechanically processed by use of a cylindrical grinder. Thepost-mechanical processing cylindrical sintered compact had a surfaceroughness Ra of 0.35 μm. The surface roughness was measured by use of asurface roughness meter (Mitutoyo Corporation; type: SJ301).

Next, two cylindrical sintered compacts obtained by the mechanicalprocessing step were bonded to a backing tube to form a cylindricalsputtering target. The difference in the relative density between thetwo cylindrical sintered compacts bonded in this step was 0.1% orsmaller. The backing tube had the following parameters.

Material: Ti

Outer diameter of the cylinder: 133 mm

Length in the axial direction of the cylinder: 300 mm

[Evaluation on the Cylindrical Sputtering Target]

The cylindrical sputtering target manufactured by the above-describedmethod was used to perform a discharge test under the followingconditions. Specifically, what ratio of the target was used, whether ornot nodule was generated, the generation frequency of the nodule,whether or not abnormal discharge occurred, the occurrence frequency ofthe abnormal discharge, the cracks at the surface of the target wereevaluated. These items were evaluated by visual inspection.

Argon gas flow rate: 300 sccm

Chamber pressure: 0.5 Pa

Power density: 4.0 W/cm²

Film formation temperature: 200° C. (or room temperature)

The cylindrical sputtering target manufactured by the method in example1 was subjected to a discharge test under the above-describedconditions. 65% of the target was used. No nodule was generated, and theabnormal discharge did not occur. No crack was found at the surface ofthe target.

Example 2

In example 2, a cylindrical sintered compact obtained by sintering acylindrical compact having a different relative density from that inexample 1 will be described. In example 2, the parameters except for thepressure at the time of molding performed by CIP and the density of thecompact were substantially the same as those in example 1 and thus willnot be described. In example 2, the mixture obtained by the granulationstep substantially the same as that in example 1 was molded by CIP tohave a cylindrical shape. The pressure at the time of molding by CIP was170 MPa. In example 2, the cylindrical compact had a density of 4.05g/cm³ and a relative density of 56.6%.

The cylindrical sintered compact obtained by sintering theabove-described cylindrical compact by substantially the same method asthat in example 1 had a density of 7.131 g/cm³ and a relative density of99.7%. In example 2, the difference in the relative density among aplurality of the cylindrical sintered compacts was 0.04%.

A cylindrical sputtering target manufactured by, for example, mechanicalprocessing performed on a plurality of the above-described cylindricalsintered compacts by substantially the same method as that in example 1was used to perform a discharge test under substantially the sameconditions as those in example 1. Like in example 1, 65% of the targetwas used. No nodule was generated, and the abnormal discharge did notoccur. No crack was found at the surface of the target.

Example 3

In example 3, a cylindrical sintered compact obtained by sintering acylindrical compact having a different relative density from that inexample 1 will be described. In example 3, the parameters except for thepressure at the time of molding performed by CIP and the density of thecompact were substantially the same as those in example 1 and thus willnot be described. In example 3, the mixture obtained by the granulationstep substantially the same as that in example 1 was molded by CIP tohave a cylindrical shape. The pressure at the time of molding by CIP was180 MPa. In example 3, the cylindrical compact had a density of 4.11g/cm³ and a relative density of 57.5%.

The cylindrical sintered compact obtained by sintering theabove-described cylindrical compact by substantially the same method asthat in example 1 had a density of 7.131 g/cm³ and a relative density of99.7%. In example 3, the difference in the relative density among aplurality of the cylindrical sintered compacts was 0.06%.

A cylindrical sputtering target manufactured by, for example, mechanicalprocessing performed on a plurality of the above-described cylindricalsintered compacts by substantially the same method as that in example 1was used to perform a discharge test under substantially the sameconditions as those in example 1. Like in example 1, 65% of the targetwas used. No nodule was generated, and the abnormal discharge did notoccur. No crack was found at the surface of the target.

Comparative examples to the cylindrical compacts and the cylindricalsintered compacts in examples 1 through 3 will be described below. Ineach of the following comparative examples, a cylindrical sinteredcompact obtained by sintering a cylindrical compact having a differentrelative density from that in example 1 will be described. In thefollowing comparative examples, the parameters except for the pressureat the time of molding performed by CIP, the density of the compact andthe density of the sintered compact were substantially the same as thosein example 1 and thus will not be described.

Comparative Example 1

In comparative example 1, the molding was performed by CIP at a pressureof 400 MPa. In comparative example 1, the cylindrical compact had adensity of 4.40 g/cm³ and a relative density of 61.5%. The cylindricalsintered compact obtained by sintering the above-described cylindricalcompact by substantially the same method as that in example 1 had adensity of 7.107 g/cm³ and a relative density of 99.4%. A cylindricalsputtering target including a plurality of the above-describedcylindrical sintered compacts was used to perform the above-describeddischarge test. Nodule was found to be generated and arcing was found tooccur when 65% of the target was used.

Comparative Example 2

In comparative example 2, the molding was performed by CIP at a pressureof 300 MPa. In comparative example 2, the cylindrical compact had adensity of 4.30 g/cm³ and a relative density of 60.1%. The cylindricalsintered compact obtained by sintering the above-described cylindricalcompact by substantially the same method as that in example 1 had adensity of 7.107 g/cm³ and a relative density of 99.4%. A cylindricalsputtering target including a plurality of the above-describedcylindrical sintered compacts was used to perform the above-describeddischarge test. Nodule was found to be generated and arcing was found tooccur when 65% of the target was used.

Comparative Example 3

In comparative example 3, the molding was performed by CIP at a pressureof 78.5 MPa. In comparative example 3, the cylindrical compact had adensity of 3.79 g/cm³ and a relative density of 53.1%. The cylindricalsintered compact obtained by sintering the above-described cylindricalcompact by substantially the same method as that in example 1 had adensity of 7.121 g/cm³ and a relative density of 99.6%. A cylindricalsputtering target including a plurality of the above-describedcylindrical sintered compacts was used to perform the above-describeddischarge test. Nodule was found to be generated and arcing was found tooccur when 65% of the target was used.

An embodiment of the present invention is not limited to any of theabove-described embodiments or examples, and may be modified in any waywithout departing from the gist thereof.

What is claimed is:
 1. A manufacturing method of a cylindricalsputtering target, comprising: sintering a plurality of cylindricalcompacts having a relative density of 55.0% or higher and 58.0% or lowerand containing ITO or IGZO to form a plurality of cylindrical sinteredcompacts having a relative density of 99.7% or higher and 99.9% orlower; and locating the plurality of cylindrical sintered compacts to beadjacent to each other having a difference therebetween in the relativedensity of 0.1% or smaller.
 2. The manufacturing method of a cylindricalsputtering target according to claim 1, further comprising performingcold isostatic pressing at a pressure of 150 MPa or higher and 200 MPaor lower to form the plurality of cylindrical compacts.
 3. Amanufacturing method of a cylindrical sintered compact, comprising:sintering a cylindrical compact having a relative density of 55.0% orhigher and 58.0% or lower and containing ITO or IGZO, the cylindricalsintered compact having a relative density of 99.7% or higher and 99.9%or lower.
 4. The manufacturing method of a cylindrical sintered compactaccording to claim 3, further comprising performing cold isostaticpressing at a pressure of 150 MPa or higher and 200 MPa or lower to formthe cylindrical compact.
 5. A cylindrical compact usable to form acylindrical sintered compact usable to manufacture a cylindricalsputtering target, the cylindrical compact having a relative density of55.0% or higher and 58.0% or lower and containing ITO or IGZO.
 6. Themanufacturing method of a cylindrical sputtering target according toclaim 1, wherein the plurality of cylindrical compacts have the relativedensity of 55.0% or higher and 57.5% or lower.
 7. The manufacturingmethod of a cylindrical sintered compact according to claim 3, whereinthe cylindrical compact has the relative density of 55.0% or higher and57.5% or lower.
 8. The cylindrical compact usable to form a cylindricalsintered compact usable to manufacture a cylindrical sputtering targetaccording to claim 5, wherein the cylindrical compact has the relativedensity of 55.0% or higher and 57.5% or lower.